Dear users, the OCS will cease operation by the end of the year 2022. PC chairs of unfinished conferences should contact for further guidance.

OCS » TIWM » Conference

Welcome to the conference service of TIWM

Info Icon

This is the main page of the conference. You are presented with a quick overview of the conference facts, as well as the current phases, if logged in. Furthermore you have direct access to actions relevant to the conference.

Your current actions

View papers View papers

With this action an overview of the currently submitted papers is presented to you. Furthermore you can see phase specific information and your possible paper-related actions.

Contact PC Chair Contact PC Chair

With this action you can contact the PC Chair via the internal message system.

Submit paper Submit paper

This conference is in the submission phase. With this action you can submit a paper directly.

Open the overview of your actions in a new page.

Furthermore you can consult the Howtos.

Name:Transactions on Intelligent Welding Manufacturing(TIWM)
Description:All positively recognized papers submitted to RWIA2018/CCRW2018 will be published by series Transactions on Intelligent Welding Manufacturing(TIWM). The following is introduction of TIWM. Transactions on Intelligent Welding Manufacturing (TIWM) is authorized by Springer,, for periodical publication of research papers and monograph on intelligentized welding manufacturing (IWM). By editing of Professor Shan-ben CHEN, Professor Yu-ming ZHANG and Professor Zhi-li FENG, the TIWM aims to echo to the more and more request from the academic and engineering community. The TIWM is a peer-reviewed research paper and book series which aims to present the latest global research findings and cutting-edge developments in intelligent welding technology which includes complex information, networking and intelligent technology throughout the entire welding manufacturing process, and concepts integrating the areas of welding materials, structures, techniques, processing, equipment, products and market analysis. The TIWM is a multidisciplinary and interdisciplinary series publication focusing on the development of intelligent modelling, controlling, monitoring, and evaluating and optimizing the manufacturing processes related to joining technology. It also provides a forum for scholars and engineers interested in recent research in artificial intelligence, control, robotics, mechatronics and information science applied to industrial and manufacturing processes, especially in welding processes. The periodical series of research papers in the TIWM features titles on new intelligentized methodologies and developments, case studies and surveys, as well as tutorials on topics related to: •Scientific theory of intelligentized welding manufacturing •Planning and optimizing of welding techniques •Virtual & digital welding /additive manufacturing •Sensing technologies for welding process •Intelligent control of welding processes and quality •Knowledge modeling of welding process •Intelligentized robotic welding technologies •Intelligentized, digitalized welding equipment •Telecontrol and network welding technologies •Intelligentized welding technology applications •Intelligentized welding workshop implementation •Other related intelligent manufacturing topics The TIWM publishes the peer-reviewed book series for the publication of: •Edited works •Original research papers •Conference proceedings •Research monographs •Advanced textbooks •Professional books •Reference works •Ph.D. Thesis •Others Submission system of the TIWM is Editors-in-Chief: Pro. Shan-ben CHEN, Shanghai Jiao Tong University, PRC, Pro. Yu-ming ZHANG, University of Kentucky, USA, Pro. Zhi-li FENG, Oak Ridge National Laboratory, USA,
PC Chairs:Shanben Chen
Na Lv
yan Zhang
YuMing Zhang
李 刚
Conference flow:Paper Submission: March 1, 2023 23:59 CET,
Paper Upload: March 1, 2023 23:59 CET,
Assignment of Reviewers: March 2, 2023 23:59 CET,
Review: March 3, 2023 23:59 CET,
Decision: March 4, 2023 23:59 CET,
Final: March 5, 2023 23:59 CET

  • View papers

    View papers

  • Contact PC Chair

    Contact PC Chair

  • Submit paper

    Submit paper